Teardown of a 1991 IBM Mainframe Module | EEVblog #1341

Cited in threads on chip packaging and cooling as a vivid look at vintage IBM mainframe module construction.

Dave Jones of EEVblog tears down a 1991 IBM 9121 thermal conduction module from a System/390 mainframe, a 63-layer ceramic hybrid module with 2772 pins worth about $250,000, and demonstrates a BGA desoldering technique.